Design Care

1

If possible, use SMD component instead of DIP component.

2

Keep all DIP components on same side (Top/Bottom).

3

The distance between 2 solder pads of 0402 components should be 0.26-0.45mm.

4

No silkscreen on VIA holes.

5

Mark the pole for polarity components.

6

Minimum trace/vias/pads spacing.

7

The distance between any two chip components should be at least 1mm;
the distance between chip component and connector should be at least 5mm.

8

Keep clear around big IC (48pins or more) and BGA. 3.8mm is recommended.

9

The solder pad size (length/width) on PCB should be larger than pin size of component.

10

Temperature sensitive components (e.g. LED, battery) may be damaged
in manual soldering process. 

11

The distance between soldering points and neighbor SMD components
should be at least 1mm.


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